SAN JOSE, Calif., Nov. 14, 2012 /PRNewswire/ — Super Micro Computer, Inc. (NASDAQ: SMCI), a global leader in high-performance, high-efficiency server technology and green computing, announces a new high-performance, high-capacity storage appliance developed in collaboration with Fusion-io (NYSE: FIO) built on Supermicro’s 3U 11x PCI-E SuperServer (SYS-6037R-TXRF)
For an optimal computer-storage-network architecture where storage density and connectivity is of importance, solutions scale up to eight ioDrive2 Duos and have a minimum 2x 40GbE or FDR/QDR IB ports. This Fusion powered SuperServer also supports 130W CPUs, up to 512GB DDR 1600MHz of memory in 16x DIMMs, 8x hot-swap 3.5″ HDD bays, dual GbE LAN (Intel® i350) ports, redundant 980W Platinum Level high-efficiency (94%) power supplies and remote server management via IPMI 2.0.
While the maximum density per RU is unrivaled in the industry for a PCI-E flash-based design, the most impressive characteristics are the flexibility of the architecture — balance between sheer throughput and IOPS — while providing the most energy efficient platform on a watts/performance basis. This joint solution is ideal for a wide array of HPC applications ranging from Financials (HFT, Derivatives trading, Black Scholes model, BGM/LIBOR market model), Government/Military (Search, Risk Analysis, Code/Decode-CODEC) to Oil and Gas exploration (Modeling, Seismic Data Interpretation, 3D Imaging Processing) and BioSciences.
“Supermicro designs solutions such as our 11x PCI-E slot SuperServer for maximum performance, efficiency and expandability and our open platforms create groundbreaking opportunities like this collaboration with Fusion-io,” said Wally Liaw, Vice President of Sales, International at Supermicro. “This new ultra high performance 24TB storage solution is the foundation for new products in our pipeline and we are looking forward to incorporate upcoming Fusion-io technologies into select HPC servers for even greater storage density at higher IOPs for the most demanding, cutting edge applications.”
“Supermicro’s new Fusion powered appliance delivers massive throughput and capacity in a very small footprint for highly efficient application acceleration,” said Will Hall, Fusion-io Vice President of OEM Sales. “Fusion-io is pleased to collaborate with Supermicro to deliver this breakthrough in powerful HPC.”
For applications that have different compute, networking, storage and form factor requirements, Supermicro has a wide range of 1U, 2U, 4U and 5U SuperServers supporting 1/2/4/8 processor configurations with up to 2TB of main memory and validated Fusion-io products with capacities ranging from 365GB to 5.12TB. This is the widest product offering from any supplier on the market today.
Click here for a complete data sheet on the SuperServer 6037R-TXRF
Fusion-io has pioneered a next generation storage memory platform for shared data decentralization that significantly improves the processing capabilities within a datacenter by relocating process-critical, or “active”, data from centralized storage to the server where it is being processed, a methodology referred to as data decentralization. Fusion’s integrated hardware and software solutions leverage non-volatile memory to significantly increase datacenter efficiency and offers enterprise grade performance, reliability, availability and manageability. Fusion’s data decentralization platform can transform legacy architectures into next generation datacenters and allows enterprises to consolidate or significantly reduce complex and expensive high performance storage, high performance networking and memory-rich servers. Fusion’s platform enables enterprises to increase the utilization, performance and efficiency of their datacenter resources and extract greater value from their information asset.